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  • SMT加工的日常故障及加工技术涉及范围
  • 本站编辑:杭州宝松电子有限公司发布日期:2019-07-25 17:22 浏览次数:

随着我国技术的迅猛发展,生活水平的提高,SMT加工除了主要是综合系统工程技术外,更是一项复杂的工序,给操作人员带来太多便利,那么大家了解SMT加工的常见问题有哪些吗?快随着小迅一起来看下关于“SMT加工的日常故障及加工技术涉及范围”的介绍吧。

With the rapid development of technology and the improvement of living standards in China, SMT processing is not only a comprehensive system engineering technology, but also a complex process, which brings too much convenience to operators. So what are the common problems of SMT processing? With Xiaoxun, let's take a look at the introduction of "the daily faults of SMT processing and the scope of processing technology".

SMT加工焊膏打印时经常会出现哪些问题

What problems often occur when SMT processes solder paste printing

在SMT贴片加工中焊膏打印是一项复杂的工序,容易出现一些缺陷,影响最终成品的质量。所以为避免在打印中经常出现一些故障,以下为大家介绍SMT加工焊膏打印常见缺点避免或解决方法:

Solder paste printing is a complex process in SMT patch processing, which is prone to some defects, affecting the quality of the final product. Therefore, in order to avoid some common faults in printing, the following is to introduce SMT process solder paste printing common shortcomings to avoid or solve the problem:

一、拉尖,一般是打印后焊盘上的焊膏会呈小山状。

1. Punching, usually after printing, solder paste on the solder pad will be hilly.

产生原因:可能是刮刀空隙或焊膏黏度太大造成。

Cause: It may be caused by the clearance of scraper or too high viscosity of solder paste.

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避免或解决办法:SMT贴片加工适当调小刮刀空隙或挑选适宜黏度的焊膏。

Avoid or solve: SMT patch processing appropriate to reduce scraper clearance or select the appropriate viscosity of solder paste.

二、焊膏太薄。

2. The solder paste is too thin.

产生原因:模板太薄;刮刀压力太大;焊膏流动性差。

Causes: the template is too thin; scraper pressure is too large; solder paste fluidity is poor.

避免或解决办法:挑选适宜厚度的钢网;挑选颗粒度和黏度适宜的焊膏;适当减轻刮刀压力。

Avoid or solve the problem: select the appropriate thickness of the steel mesh; select the appropriate particle size and viscosity of solder paste; appropriate reduction of scraper pressure.

三、打印后,焊盘上焊膏厚度不一。

3. After printing, the thickness of solder paste on the pad varies.

产生原因:焊膏拌和不均匀,使得粒度不共同;模板与印制板不平行。

Causes: solder paste mixing and uneven, making the particle size is not common; template and PCB are not parallel.

避免或解决办法:在打印前充分拌和焊膏;调整模板与印制板的相对方位。

Avoid or solve: mix solder paste fully before printing; adjust the relative orientation of template and PCB.

四、厚度不相同,边际和外表有毛刺。

4. Different thicknesses with burrs in the margin and appearance.

产生原因:可能是焊膏黏度偏低,模板开孔孔壁粗糙。

Cause: It may be that the paste viscosity is low and the hole wall of the template is rough.

避免或解决办法:挑选黏度略高的焊膏;打印前查看模板开孔的蚀刻质量。

Avoid or solve: select solder paste with slightly higher viscosity; check the etching quality of template hole before printing.

五、陷落,指的是打印后,焊膏往焊盘两头陷落。

5. Collapse means that after printing, solder paste sinks to both ends of the pad.

产生原因:刮刀压力太大;印制板定位不牢;焊膏黏度或金属含量太低。

Causes: too much scraper pressure; improper positioning of PCB; too low solder paste viscosity or metal content.

避免或解决办法:调整压力;从头固定印制板;挑选适宜黏度的焊膏。

Avoid or solve: adjust pressure; fix PCB from scratch; select solder paste with suitable viscosity.

SMT加工技术涉及的范围包括哪些

What Are the Scopes of SMT Processing Technology?

SMT是一项综合的系统工程技术,其涉及范围包括基板、设计、设备、元器件、组装工艺、生产辅料和管理等。SMT设备和SMT工艺对操作现场要求电压要稳定,要防止电磁干扰,要防静电,要有良好的照明和废气排放设施,对操作环境的温度、湿度、空气清洁度等都有专门要求,操作人员也应经过专业技术培训。

SMT is a comprehensive system engineering technology, which covers the baseboard, design, equipment, components, assembly process, production accessories and management, etc. SMT equipment and SMT process require stable voltage on the operation site, to prevent electromagnetic interference, to prevent static electricity, to have good lighting and exhaust emission facilities, to have special requirements for operating environment temperature, humidity, air cleanliness, and so on. Operators should also undergo professional technical training.

回流焊:定义为通过熔化先分配到PCB上的焊膏,实现表面贴装元器件和PCB焊盘的连接。

Reflow soldering: It is defined as the connection of surface mounted components and PCB pads by melting solder paste first distributed to PCB.

波峰焊:将熔化的焊料经专业设备喷流而成设计需要的焊料波峰,使预先装有电子元器件的PCB通过焊料波峰,实现元器件与PCB焊盘之间的连接。

Wave soldering: The melted solder is sprayed by professional equipment to form the required solder peak. PCB with electronic components is connected with PCB pad through solder peak.

SMT表面组装技术是一组技术密集、知识密集的技术群,涉及元器件的封装、电路基板技术、印刷技术、自动控制技术、软钎焊技术、物理、化工、新塑料材料等多种专业和学科。

SMT surface assembly technology is a group of technology-intensive and knowledge-intensive technology groups, involving the packaging of components, circuit board technology, printing technology, automatic control technology, brazing technology, physics, chemical industry, new plastic materials and other specialties and disciplines.

表面贴装技术的关键取决于三方面因素,一是使用的设备,也就是SMT的硬件设施;二是装联工艺,SMT的软件技术;三是电子元器件,它既是SMT的基础,更是SMT行业发展的动力所在。

The key of surface mounting technology depends on three factors: the equipment used, that is, the hardware facilities of SMT; the assembly process, the software technology of SMT; and the electronic components, which are not only the foundation of SMT, but also the driving force for the development of SMT industry.

以上关于“SMT加工焊膏打印时经常会出现哪些问题”和“SMT加工技术涉及的范围包括哪些”的介绍,希望能让您了解“SMT加工的日常故障及加工技术涉及范围”带来帮助。

The above introduction about "what problems often occur in SMT processing solder paste printing" and "what areas are involved in SMT processing technology" hopes to help you understand "the daily faults of SMT processing and the scope of processing technology".